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SPRING PROBE TECHNOLOGY IN CONNECTORS

When selecting a connector for a given application the design engineer is faced with the challenge of balancing many needs, both technically and commercially. While many connector systems can be purchased off the shelf or through traditional sales channels, many standard products trade compromise in performance with wider market acceptance.

Spring contact technology delivers a diverse range of building blocks to the engineer by:

Simplfying product design through eliminating mating counterparts
Enabling higher density connections - 0.4mm between centers
Shortening board-to-board heights to < 3mm
Extending product lifetime with > 500,000 reliable mating cycles
Exceptional blind mating characteristics allows for simple product assembly or relaxation of critical dimensions.

Spring contact probes offer an exceptionally stable, highly consistent interface, even under the harshest conditions. These characteristics are the reason many of the top US defense and medical technology companies chose IDI spring contact probes and connectors as their preferred choice for interconnection. IDI technology can provide:

Consistent performance, first stroke, every stroke
Reliability over the life span of the product
Million-cycle mechanical lifetimes
Low, consistent resistance
High current capacities
Constant contact when exposed to shock, vibration, and acceleration
Versatility of mounting and profile
High performance under extreme conditions
Extremely high density
Z Axis compliancy

Probe Connector Types
			DC Surface/Compression Mount Fine pitch – down to 0.4 mm Serviceability – contacts are easily replaced in the field Zero-risk installation – no chance of damage to interface when installed Current capacity >7 Amps

			RF Surface/Compression Mount High density – pitches as fine as 0.4 mm Low profile connection Abbreviated signal path Bandwidths well above 10 GHz Current capacity >7 Amps Coaxial versions available

			RF Cabled Versatile signal path Controlled impedance from end to end Wide variety of termination options Bandwidths above 12 GHz

			DC Wired Maximum versatility – easily implemented in almost any application Suited for low volume production Remote, mobile, or decentralized signal path Current capacities up to 40 Amps

			DC Surface Mount Soldered • Pitch as fine as 1.27 mm • Plastic modules make insertion and mounting easy • Short signal paths available for good RF performance • Low profile interconnects available

			DC Through Hole • Single-contact or headerized options • Rugged physical structure and mounting • Suited to automated or manual contact insertion • High current options available • Outstanding compliance and force capability