Analytical Capabilities

In more complex socket designs, it is often necessary to model the socket's performance to guarantee that the socket design is mechanically robust while delivering virtually transparent signal paths. Listed below are some of the types of analysis performed by IDI.

Structural Finite Element Analysis

Determines the yield failure due to pin array and lid force, as well as socket deflection at the pin array.

Thermal FEA

Determines power dissipation from the package. Steady State Analysis is performed.

Spring Probe Travel Analysis

• Preload – Level 1 - Monte Carlo analysis verifies the spring probe is always in contact with the load board when mounted. This analysis assumes a constant socket deflection.
• Preload – Level 2 - Analysis is typically required for higher pin count sockets. It uses variable socket deflection based on additional structural FEA.
• Preload – Level 3 - This level adds a lid travel analysis. 
• Compression - Monte Carlo analysis optimizes spring life, contact life, CRES and force.
• Post Preload Compression - Monte Carlo analysis checks for continuity and pin bottoming in socket. 

Contactor Alignment Analysis

• Alignment to Load Board - This analysis checks dowel pins size and position.
• Spring Probe to Load Board - Monte Carlo analysis checks the probe contact to load board pad alignment.
• DUT Into IC Pocket Fit - Analysis checks that the min/max package body against the IC pocket.
• Spring Probe to DUT - Monte Carlo analysis method checks the DUT to top contact alignment.
• Package Damage due to Misalignment - Monte Carlo analysis checks for ball or pin shear.
• Alignment with CTE Considerations - Monte Carlo analysis checks the CTE of each material in the specific test temperature environment.
• Lid Alignment - Platen to IC Pocket - Prevent damage to IC pocket walls. Heatsink to Die - Prevent die cracking
• DUT/LID/Heatsingk Travel - Analysis for DUT force balance. Force balancing for PoP systems - substrate and die.  Prevents damage to package or die.
• Handler Alignment - Handler placement and positional accuracy into IC pocket. Package theta rotational accuracy.
• Spring Probe Pointing Accuracy - Prevents damage to spring probe tip and load board pads.