High Performance Test Sockets

QFN Test Sockets

For over three decades, IDI has lead the industry in innovation.  When you purchase an IDI test socket, you are using the most advanced interconnect available for semiconductor test.

Dyno Test Socket

With the patent pending Dyno Test Socket, you can get an innovative way to test lead free QFNs and other peripheral devices on 0.5mm and above. These test sockets provide consistent low and stable resistance with minimal cleaning and a mechanical cycle life of greater than 500,000 – which results in higher first past yields and a lower cost of test.

Lead-Free Devices

The Homogeneous Probe series features device contact tips made from a custom developed solid precious metal alloy, usable without any additional plating process.

This method of construction offers a robust structure capable of withstanding extreme cleaning techniques associated with the testing of SAC-105 BGA and NiPdAu QFN packages.

Off-Set Kelvin Test Socket

IDI has developed an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that’s flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm. Plus, the Offset Kelvin contact is uniquely suited to a production environment because of its long life, ease of maintenance and tolerance for device misalignment.

Peripheral Family Sockets

Peripheral family standard sockets include an alignment ring. Designing with an alignment ring   allows replacement of the alignment features of the socket without replacing the entire socket. This will lead to a higher cost savings.Sockets are configurable with any spring pin at any pitch.
  • Socket frames are made from aluminum, thus eliminating or reducing the amount of bowing that occurs in high pin count socket applications.
  • Sockets are designed with maximum component clearance and are top mount for easy removal. 
  • Bottom mount is available upon request.


image description

R&D Test Lab

Our commitment to “first-cycle, every-cycle" reliability is backed by the extensive product testing and evaluation performed in our Test Lab.

Go to R&D Test Lab

image description

Info Request

IDI has Sales and Application Engineering Offices around the world to support our global customers.

Email IDI
divider